Method And System For Reducing Thermal Leak By Decoupling A Thermal Interface

ABSTRACT

The present disclosure relates to issues that may arise from power loss in temperature control systems, such as a heat pump or thermal engine. According to the present disclosure, a temperature control system may comprise a temperature-controlling device configured to control a temperature-controlled unit. The temperature-controlling device and the temperature-controlling device may be thermally connectable through a thermal path connector. The thermal path connector may be actuatable, wherein actuation of the thermal path connector breaks the thermal path between the temperature-controlling device and the temperature-controlled unit, wherein the break limits temperature leak. Actuation may occur during power loss, which may allow for sustained temperatures without additional power.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the full benefit of U.S.Provisional Patent Application Ser. No. 62/954,452, filed Dec. 28, 2019,and titled “METHOD AND SYSTEM FOR REDUCING THERMAL LEAK BY DECOUPLING ATHERMAL INTERFACE”, the entire contents of which are incorporated inthis application by reference.

BACKGROUND

Heat leak is a common problem associated with the process of heating orcooling. One of the most prolific solutions to heat leak is insulation,which generally addresses heat leak throughout a system. Issues of heatleak are often exacerbated during a power loss where electrical controlof a system is not possible. In those cases, passive insulation may bethe only mitigating factor for the heat loss. By the time power isrestored to a system, the temperature within the heater or cooler may beoutside an acceptable threshold range. For example, a loss of power maycause objects in a freezer to melt.

Heat leak related to coolers and heaters for temperature-sensitiveobjects is a larger concern, where a difference of mere degrees maycause damage. Again, the most common solution is to add insulation, suchas a vacuum jacket. Back-up power sources, such as generators, areanother common solution to issues associated with power loss. Heat leakcaused by backflow of heat or cold is particularly significant insystems that rely on the transfer of heat against a thermal gradient.

These issues are exacerbated the further removed one is from certainenvironmental conditions, such as gravity or the natural heat of theEarth. Due to the extreme temperatures cause by the sun (or lackthereof) encountered outside of Earth's ozone, it is difficult toregulate normal temperatures, much less extreme cold or extreme heat asneeded for in-space processes. If power is lost for any amount of time,the extreme temperature inside the cryocooler is continually gainingheat, which could disrupt any heat-dependent processes. Space stationslikely do not have multiple sources that can produce the same extremetemperature. The process cannot be quickly transferred to anothercryocooler or machine since there may not be alternatives available.This may cause irreparable equipment damage and loss of what material isheld in a container, such as science or sensitive matter or substances.

SUMMARY OF THE DISCLOSURE

What is needed is a way to limit a heat leak during power loss of atemperature control system, particularly for systems that rely onheating or cooling against a thermal gradient. Heating or coolingagainst a thermal gradient generally requires a power source, and whenthe power source is removed, the temperatures naturally try to establishequilibrium with the surrounding environment, which can result insignificant loss of temperature control. In some aspects, a loss ofpower in a temperature control system may cause a heat leak that mayplace the temperature of the load outside a target range, potentiallycausing damage to the load.

Accordingly, the present disclosure relates to issues that may arisefrom power loss in temperature control systems, such as a heat pump orthermal engine. The present disclosure addresses this problem bybreaking the thermal path between the cooler and load during power loss.The system may comprise a series of energy storage devices such ascapacitors that may store enough energy to electromechanically actuateor displace the thermal connection to the Stirling engine when thesystem input voltage drops below a critical threshold. In someembodiments, the movement of the Stirling cooler may stretch theedge-welded bellows between it and the vacuum jacket, which may breakthe thermal path.

In this condition, particularly where the conductive interface islocated within a vacuum jacket, heat transfer back into the system maybe limited to radiation across the gap, which yields heat losses thatare dramatically reduced from traditional stationary installations.Without a vacuum jacket, the heat transfer may occur through convectionin addition to radiation, which would still be significantly less thanif the thermal path remained intact.

In some implementations, a cooler may be electro-mechanically actuatedalong its axis, wherein the physical movement may break the conductiveinterface, breaking thermal conductive contact with the rest of thestructure. This may reduce heat leak during a power loss condition. Insome embodiments, actuation of a cooler may be practical where aflexible edge-welded bellow is welded between the cooler and vacuumjacket structure, which may allow for limited extension and compression.

In some aspects, a mechanism to break a thermal path may be utilized inconjunction with other power loss solutions, such as battery backups andgenerators. In contrast to traditional solutions that attempt tocontinue power supply or add insulation, breaking a thermal path may addminimal mass to the system.

The present disclosure relates to a temperature control system. In someembodiments, the temperature control system may comprise atemperature-controlled unit; a temperature controlling device configuredto control a temperature of the temperature-controlled unit, where thetemperature controlling device may be connectable to a power source; athermal path connector; an actuatable connector; a first thermalinterface connectable to the temperature-controlled unit; a second end;a second thermal interface connectable to the temperature-controllingdevice; and an actuation mechanism configured to actuate the actuatableconnector based on predefined parameters. In some implementations,actuation of the actuatable connector may control connection of one orboth the first thermal interface to the temperature-controlled unit andthe second thermal interface and the temperature-controlling device, andwhere, when connected, a thermal path between the temperature-controlledunit and the temperature-controlling device may be continuous, andwhere, when one or both the first thermal interface and the secondthermal interface may be disconnected, the thermal path may be broken.

In some embodiments, actuation of the thermal path connector may occurwith power loss. In some implementations, the temperature control systemmay comprise a power detector configured to detect power loss, where thepower detector prompts actuation of the thermal path connector. In someaspects, the temperature-controlled unit may comprise a plurality ofzones, where temperature of each zone may be independently controllable.

In some embodiments, the temperature-controlling device may comprise athermodynamic engine. In some implementations, thetemperature-controlled unit may comprise: a containing portion that maycomprise a cavity may comprise at least a first containing wall tocontain a load, where the temperature-controlling device directly orindirectly controls a load temperature when the load may be locatedwithin the cavity, an opening configured to receive the load into thecavity; and a lid may comprise a movable cover configured to controlaccess to the opening, where a closed position of the lid limits passivetemperature change within the cavity.

In some embodiments, one or both the lid and the opening further maycomprise rigid bellows configured to limit passive temperature changewithin the cavity. In some implementations, the temperature-controlledunit further may comprise a second containing wall, where the secondcontaining wall surrounds the first containing wall. In some aspects, aspace between the first containing wall and the second containing wallmay comprise a vacuum jacket. In some embodiments, the temperaturecontrol system may be configured to operate in one or both microgravityor zero gravity conditions.

In some implementations, the actuatable connector may comprise a thermalstrap. In some aspects, the thermal path connector may comprise a pivotmechanism connected to the actuatable connector, where actuation of theactuatable connector occurs by pivoting the thermal path connector andwhere pivoting disconnects one or both the first thermal interface andthe second thermal interface. In some embodiments, breaking the thermalpath may limit passive temperature change of the temperature-controlledunit.

In some implementations, actuation of the actuatable connector may occurwith power loss. In some aspects, a resting state of the thermal pathconnector disconnects one or both the first thermal interface to thetemperature-controlled unit and the second thermal interface and thetemperature-controlling device. In some embodiments, actuation of theactuatable connector may control connection of one or both the thirdthermal interface and the fourth thermal interface, and where when boththe second thermal interface and the fourth thermal interface areconnected a thermal path between the temperature-controlled unit and atleast the second portion of temperature-controlling devices may becontinuous, and where when one or both the third thermal interface andthe fourth thermal interface may be disconnected, the thermal path maybe broken.

In some implementations, breaking the thermal path may limit passivetemperature change of the temperature-controlled unit. In some aspects,the actuatable connector may comprise a thermal strap. Implementationsof the described techniques may comprise hardware, a method or process,or computer software on a computer-accessible medium.

The present disclosure relates to a thermal path connector. In someembodiments, the thermal path connector may comprise an actuatableconnector may comprise a first end may comprise a first thermalinterface connectable to a temperature-controlled unit; a second end maycomprise a second thermal interface connectable to atemperature-controlling device; and an actuation mechanism configured toactuate the actuatable connector based on predefined parameters, whereactuation of the actuatable connector controls connection of one or boththe first thermal interface to the temperature-controlled unit and thesecond thermal interface and the temperature-controlling device, andwhere when connected a thermal path between the temperature-controlledunit and the temperature-controlling device may be continuous, and wherewhen one or both the first thermal interface and the second thermalinterface may be disconnected, the thermal path may be broken.

The present disclosure relates to a temperature control system. In someembodiments, a temperature control system may comprise atemperature-controlled unit; a plurality of temperature-controllingdevices connectable to a power source, wherein each of the plurality oftemperature-controlling devices is configured to control temperature ofthe temperature-controlled unit when connected to the power source; anda first thermal path connector.

In some implementations, the first thermal path connector may comprise afirst actuatable connector that may comprise a first end comprising afirst thermal interface connectable to the temperature-controlled unit,a second end comprising a second thermal interface connectable to atleast a first portion of the plurality of temperature-controllingdevices, and a first actuation mechanism configured to actuate the firstactuatable connector based on predefined parameters, wherein actuationof the first actuatable connector controls connection of one or both thefirst thermal interface and the second thermal interface, and whereinwhen both the first thermal interface and the second thermal interfaceare connected a thermal path between the temperature-controlled unit andat least the first portion of temperature-controlling devices iscontinuous, and wherein when one or both the first thermal interface andthe second thermal interface is disconnected, the thermal path isbroken.

In some embodiments, the system may further comprise a second thermalpath connector comprising a second actuatable connector comprising athird end comprising a first thermal interface connectable to thetemperature-controlled unit, a second end comprising a second thermalinterface connectable to at least a second portion of the plurality oftemperature-controlling devices, and a second actuation mechanismconfigured to actuate the second actuatable connector based onpredefined parameters, wherein actuation of the actuatable connectorcontrols connection of one or both the third thermal interface and thefourth thermal interface, and wherein when both the second thermalinterface and the fourth thermal interface are connected a thermal pathbetween the temperature-controlled unit and at least the second portionof temperature-controlling devices is continuous, and wherein when oneor both the third thermal interface and the fourth thermal interface isdisconnected, the thermal path is broken. In some implementations,breaking the thermal path may limit passive temperature change of thetemperature-controlled unit.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings that are incorporated in and constitute a partof this specification illustrate several embodiments of the disclosureand, together with the description, serve to explain the principles ofthe disclosure:

FIG. 1A illustrates an exemplary temperature control system according tosome embodiments of the present disclosure.

FIG. 1B illustrates an exemplary temperature control system according tosome embodiments of the present disclosure.

FIG. 2A illustrates an exemplary temperature control system with an openthermal path, according to some embodiments of the present disclosure.

FIG. 2B illustrates a segment of an exemplary temperature control systemwith a closed thermal path, according to some embodiments of the presentdisclosure.

FIG. 2C illustrates a segment of an exemplary temperature control systemwith an open thermal path, according to some embodiments of the presentdisclosure.

FIG. 3A illustrates an exemplary temperature control system, accordingto some embodiments of the present disclosure.

FIG. 3B illustrates an exemplary temperature control system, accordingto some embodiments of the present disclosure.

FIG. 4A illustrates an exemplary temperature control system with an openthermal path, according to some embodiments of the present disclosure.

FIG. 4B illustrates a segment of an exemplary temperature control systemwith a closed thermal path, according to some embodiments of the presentdisclosure.

FIG. 4C illustrates an exemplary embodiment of a thermal path connector,according to some embodiments of the present disclosure.

FIG. 5A illustrates an exemplary temperature control system with an openthermal path, according to some embodiments of the present disclosure.

FIG. 5B illustrates a segment of an exemplary temperature control systemwith a closed thermal path, according to some embodiments of the presentdisclosure.

FIG. 6A illustrates a portion of an exemplary temperature control systemwith an open thermal path, according to some embodiments of the presentdisclosure.

FIG. 6B illustrates a portion of an exemplary temperature control systemwith a closed thermal path, according to some embodiments of the presentdisclosure.

FIG. 7 illustrates an exemplary temperature control system with anactuation mechanism, wherein actuation shifts temperature-controlledunit, according to some embodiments of the present disclosure.

FIG. 8A illustrates an exemplary temperature control system with aclosed thermal path, wherein a rigid conductive bar provides a thermalpath between heat sinks, according to some embodiments of the presentdisclosure.

FIG. 8B illustrates an exemplary temperature control system with an openthermal path, wherein a rigid conductive bar provides a thermal pathbetween heat sinks, according to some embodiments of the presentdisclosure.

FIG. 9A illustrates an exemplary temperature control system with aclosed thermal path, according to some embodiments of the presentdisclosure.

FIG. 9B illustrates an exemplary temperature control system with an openthermal path, according to some embodiments of the present disclosure.

FIG. 10A illustrates a portion of an exemplary temperature controlsystem with an open thermal path, wherein control of the thermal pathoccurs electromagnetically, according to some embodiments of the presentdisclosure.

FIG. 10B illustrates a portion of an exemplary temperature controlsystem with a closed thermal path, wherein control of the thermal pathoccurs electromagnetically, according to some embodiments of the presentdisclosure.

FIG. 11A illustrates a portion of an exemplary temperature controlsystem with an open thermal path, wherein the thermal path comprises anormally open configuration, according to some embodiments of thepresent disclosure.

FIG. 11B illustrates a portion of an exemplary temperature controlsystem with a closed thermal path, wherein the thermal path comprises anormally open configuration, according to some embodiments of thepresent disclosure.

FIG. 12A illustrates an exemplary embodiment of a container within thetemperature-controlled unit, according to some embodiments of thepresent disclosure.

FIG. 12B illustrates an exemplary embodiment of a container within thetemperature-controlled unit, according to some embodiments of thepresent disclosure.

FIG. 13A illustrates an exemplary cut-view of an embodiment of atemperature-controlled unit with rigid bellows, a vacuum jacket, andconvective properties, according to some embodiments of the presentdisclosure.

FIG. 13B illustrates an exemplary cut-view of an embodiment of atemperature-controlled unit with rigid bellows, a vacuum jacket, andconvective properties, according to some embodiments of the presentdisclosure.

FIG. 13C illustrates an exemplary temperature-controlled unit comprisinga container, wherein the container is in an open position.

FIG. 13D illustrates exemplary rigid bellows, according to someembodiments of the present disclosure.

FIG. 13E illustrates exemplary rigid bellows, according to someembodiments of the present disclosure.

FIG. 14A illustrates an exemplary insulated vacuum jacket, rigidbellows, and a plurality of conductive surfaces within thetemperature-controlled unit, according to some embodiments of thepresent disclosure.

FIG. 14B illustrates an exemplary insulated vacuum jacket, rigidbellows, and a plurality of conductive surfaces within the temperaturecontrolled unit, according to some embodiments of the presentdisclosure.

FIG. 15A illustrates an exemplary thermal path that connects to the lidwithin the temperature-controlled unit, according to some embodiments ofthe present disclosure.

FIG. 15B illustrates an exemplary thermal path that connects to the lidwithin the temperature-controlled unit, according to some embodiments ofthe present disclosure.

FIG. 16A illustrates an exemplary visual temperature indicator,according to some embodiments of the present disclosure.

FIG. 16B illustrates an exemplary visual temperature indicator,according to some embodiments of the present disclosure.

FIG. 17A illustrates an exemplary rotating external temperature controlsystem, according to some embodiments of the present disclosure.

FIG. 17B illustrates an exemplary rotating external temperature controlsystem, according to some embodiments of the present disclosure.

FIG. 18 illustrates an exemplary temperature control system comprising aplurality of temperature-controlled unit, according to some embodimentsof the present disclosure.

FIG. 19 illustrates an exemplary cycle of connecting and breaking athermal path within a thermal system, according to some embodiments ofthe present disclosure.

FIG. 20 illustrates exemplary method steps for breaking a thermal pathin response to a detected loss in power, wherein the thermal pathcomprises a normally closed configuration, according to some embodimentsof the present disclosure.

FIG. 21 illustrates exemplary method steps for engaging a thermal pathupon receipt of power, wherein the thermal path comprises a normallyopen configuration, according to some embodiments of the presentdisclosure.

DETAILED DESCRIPTION

In the following sections, detailed descriptions of examples and methodsof the disclosure will be given. The description of both preferred andalternative examples, though thorough, are exemplary only, and it isunderstood to those skilled in the art that variations, modifications,and alterations may be apparent. It is therefore to be understood thatthe examples do not limit the broadness of the aspects of the underlyingdisclosure as defined by the claims.

Glossary

-   -   Temperature-Controlled Unit: as used herein refers to the        portion of the temperature control system that is targeted for        temperature control. In some embodiments, the        temperature-controlled unit may operate without power. The        temperature-controlled unit may slow heat transfer sufficient to        allow for controlled temperature retention within the        temperature threshold. In some implementations, the        temperature-controlled unit may transmit information indicating        the expiration period of the integrity of the temperature within        the temperature-controlled unit after a disconnection with a        power source. In some aspects, a temperature-controlled unit may        comprise a container configured to hold a load, wherein the        container may comprise an opening, lid, and cavity. The opening        may accept a load into the cavity, and the lid may control        access to the opening and cavity.    -   Temperature Controlling Device: as used herein refers to a        device directly or indirectly thermally connectable to a        temperature-controlled unit such as through the thermal path        connector. When the thermal path is continuous, a        temperature-controlling device may heat or cool the        temperature-controlled unit. As non-limiting examples, a        temperature control system may comprise a Stirling engine        cryocooler, a heat pump, a thermal engine, thermoelectric        plates, or a solid-state cooler.    -   Flexible Bellows: as used herein refers to a connector mechanism        that may change in length or orientation when subjected to        outside force.    -   Rigid Bellows: as used herein refers to a pleated edge that        limits leak of heat or cold. In some embodiments, rigid bellows        may comprise edge-welded bellows. In some aspects, rigid bellows        may be located on a perimeter of one or both a lid of a        temperature-controlled unit and an opening of a        temperature-controlled unit. The lid and opening of a        temperature-controlled unit may be particularly susceptible to        temperature leak.    -   Temperature Control System: as used herein refers to a system        configured to control a temperature of a load. In some aspects,        a temperature control system may comprise a        temperature-controlling device thermally connectable to a        temperature-controlled unit, wherein connection may be        controlled at least in part by a thermal path connector. In some        embodiments, a temperature control system may comprise a power        source. In some implementations, a temperature control system        may be connected to an external power source, such as power from        a space station, manufacturing plant, or space craft, as        non-limiting examples.    -   Temperature Leak: as used herein refers to a loss of temperature        control. For example, where a temperature-controlling device may        cool a temperature-controlled unit, a temperature leak may        comprise heat gain. Where a temperature-controlling device may        heat a temperature-controlling device, a temperature leak may        comprise heat loss. Temperature leak may occur passively with or        without power, such as at connection points within a TCS.        Temperature leak may occur during loss of power when temperature        equilibrium may naturally shift temperature from a        temperature-controlled unit back to a temperature-controlling        device.    -   Heat or heating: as used herein refers to a temperature warmer        than another temperature in the temperature control system. The        term heat is used relative to the term cold. For example, heat        may comprise −70 degrees C. and cold may comprise −80 degrees C.    -   Cold or cooling: as used herein refers to a temperature cooler        than another temperature in the temperature control system. The        term cold is used relative to the term heat. For example, cold        may comprise 75 degrees C. and heat may comprise 80 degrees C.    -   Conductive Interface: as used herein refers to a connection        point along a thermal path. In some embodiments, a conductive        interface may occur in one or more locations along the thermal        path. As non-limiting examples, conductive interfaces may be        located at the junction between a thermal strap and a cryocooler        finger, at the junction between a heat sink and a thermal bar.    -   Thermal Path: as used herein refers to a path that allows for a        thermal connection between a temperature-controlling device and        temperature-controlled unit. In some aspects, a thermal path        connector controls continuity of the thermal path.    -   Thermal Path Connector (thermal path connector): as used herein        refers to a moveable conductive piece that connects the thermal        path between the temperature-controlling device and the        temperature-controlled unit. In some embodiments, the thermal        path connector may disconnect or be disconnectable from the        temperature-controlling device or temperature-controlled unit at        a conductive interface wherein disconnecting breaks the thermal        path between the temperature-controlling device and the        temperature-controlled unit. In some aspects, the conductive        interface may be located at one or more locations such as        between the thermal path connector and the        temperature-controlling device, between the thermal path        connector and the temperature-controlled unit, within the        thermal path connector, or any combination thereof. In some        aspects, such as with a Stirling engine, a thermal path        connector may be continuous through a thermal strap of flexible        material between a heat sink and cryocooler finger. In some        embodiments, a thermal path connector may comprise a rigid bar        with limited flexibility. In some implementations, such as with        thermoelectric plates, a thermal path connector may comprise        semiconductor pillars.    -   Load: as used herein refers to an object or container that may        be directly or indirectly temperature controlled by a        temperature control system. In some aspects, a load may be        directly connected to the temperature control system. In some        embodiments, a load may be indirectly controlled by placing it        in a container directly controlled by the temperature control        system. A load may be indirectly controlled by a        temperature-controlled unit that is directly or indirectly        connected by a thermal path connector to a        temperature-controlling device. In some implementations, a        temperature-controlled unit may comprise a container that may        accept a load.

Referring now to FIGS. 1A-1B, an exemplary embodiment of a temperaturecontrol system 100 is illustrated. In some embodiments, thetemperature-controlled unit 110 may be connected to atemperature-controlling device 105 via a thermal path connector 130. Insome implementations, the temperature-controlling device 105 may beexternal to the temperature control system 100. In some aspects, thetemperature-controlling device may receive thermal energy from anexternal source. For example, in environments of extreme temperaturesuch as outer space, the temperature control system may utilize theambient temperature of space to cool the temperature-controlled unit110. This may be helpful when radiance from the sun causes dramaticincreases in temperature that can be negated by utilizing and focusingthe existing temperature of space to cool an exposed element.

In some embodiments, a power supply may exist as a live connection to alarger source of energy. In some implementations, the power supply maybe portable. For example, a removeable battery with insertable prongsmay be attached to the top of the temperature control system 100. Thismay be useful in applications where connections may impede the use ofthe temperature control system in aspects of motion, such as rotationaround the outside of a satellite.

Referring now to FIG. 2A, an exemplary temperature control system 200 isillustrated. In some aspects, a temperature control system 200 maycomprise a temperature-controlling device 205 connected to atemperature-controlled unit 210, wherein the temperature control system200 may control the temperature of loads placed in thetemperature-controlled unit 210. In some embodiments, the temperaturecontrol system 200 may comprise a temperature-controlling device 205with a passive heat exchanger 215 and a temperature-controlling deviceconnector 220. In some implementations, the temperature-controllingdevice connector 220 may connect to the temperature-controlled unit 210via a thermal path connector 230. For example, a thermal strap mayfacilitate heat transfer between the temperature-controlled unit 210 andthe temperature-controlling device connector 220.

In some aspects, where the object may be cooled, the heat input side mayoccur at a conductive interface, and the heat output side may occurthrough the temperature-controlled unit 210. In some embodiments, wherethe object may be heated, the heat output side may occur intotemperature-controlled unit 210, and the heat input side may occur at aconductive interface, wherein the thermal path connector 230 and thepassive heat exchanger 215 may be reversed in location. In some aspects,the temperature-controlled unit 210 may be surrounded by a vacuum jacket255, which may provide insulation. In some embodiments, thetemperature-controlled unit 210 may be surround by phase changematerial, which may act as a thermal energy battery. In someimplementations, a thermal energy battery may store and release thermalenergy, which may allow for more efficient storage and release of energythan if no thermal energy battery was in place.

In some embodiments, a power sensor may discern between intentional andexpected power loss. For example, if the power source is removedintentionally, the intended result may be to return to ambienttemperature, and a break in the thermal path may delay that process. Insome implementations, power loss intended to allow for a temperatureleak may maintain continuity of the thermal path. Power loss that isunintentional or power loss that is still intended to maintain atemperature may trigger actuation of a thermal path connector.

In some aspects, terminating power may occur at a different rate, whichmay allow the power sensor to distinguish between intentional andunintentional power loss. In some embodiments, manual power loss mayprovide an option to prevent the actuator power sources from providingpower to the actuator. As non-limiting examples, a temperature controlsystem 200 may be used to maintain temperatures for space flighthardware, heat exchangers, and cold trap condensers.

Referring now to FIG. 2B, a segment of an exemplary temperature controlsystem 200 with a closed thermal path is illustrated. In some aspects,the temperature-controlling device 205 may comprise bellows 225, whichmay allowing for limited movement of the temperature-controlled unit 210based on extension and compression of the bellows 225. In someembodiments, a conductive interface 235 may occur between a thermal pathconnector 230 and temperature-controlling device connector 220.

Referring now to FIG. 2C, a segment of an exemplary temperature controlsystem 200 with an open thermal path is illustrated. In someembodiments, the temperature-controlling device 205 may be shifted awayfrom the thermal path connector 230, which may separate the conductiveinterface 235, breaking the thermal path between thetemperature-controlled unit 210 and temperature-controlling device 205.Actuating the temperature-controlling device 205 away from theconductive surface 235 may compress the bellows 225. The gap formed atthe conductive surface 235 may contain surrounding atmosphere. In someembodiments, the gap may contain a vacuum. In some implementations, aninsulative liquid or other material may be inserted between the thermalpath connector 230 and temperature-controlling device connector 220. Atemperature control system 200 may comprise elements to provide vacuumor the insulative or liquid or other material when thetemperature-controlled unit 210 is physically disengaged from thetemperature-controlling device connector 220.

In some embodiments, the bellows 225 may affect the power requirementsfor actuation. For example, the resting state of the bellows may be inthe compressed configuration for breaking the conductive surface 235,which may lower the power requirements to actuate the thermal pathconnector 230, as the bellows 225 may act as a spring. As non-limitingexamples, actuation may be performed by linear or rotary actuators,solenoids, stepper, servo, DC motor, or BLDC driven. In someembodiments, other elements (e.g., actuating pins) are utilized to lockor hold the temperature-controlling device connector 220 in a positionwhere it does not contact thermal path connector 230 or otherwisecontact the temperature-controlled unit 210.

Referring now to FIGS. 3A and 3B, an exemplary embodiment of atemperature control system 300 is illustrated. In some embodiments, thethermal energy may be created in the temperature-controlling device 305.In some implementations, the temperature-controlling device 305 mayconnect directly or indirectly to the temperature-controlled unit 310via the thermal path connector 330. In some aspects, the thermal pathconnector 330 may enter the container 350 of the temperature-controlledunit 310. The thermal path connector 330 may connect thetemperature-controlling device 305 to the temperature-controlled unit310 through a conductive surface 335 that may transfer heat throughoutthe temperature-controlled unit.

In some embodiments, the temperature-controlled unit 310 may comprise acontainer 350, which may be surrounded by a vacuum jacket 355. Thecontainer portion may comprise a cavity and an opening configured toaccept a load into the cavity. The container 350 may comprise a lid thatis a movable cover configured to control access to the opening. One orboth the lid and opening may comprise material and features that maylimit temperature leak, such as rigid bellows 365, insulation, ortemperature-specific materials.

In some implementations, the thermal path connector 330 may penetratethe vacuum jacket 355 as it connects to the temperature-controlled unit310. In some aspects, a plurality of conductive surfaces may connect tothe thermal path connector 330 to disseminate the transferred thermalenergy into the temperature-controlled unit 310. In some embodiments,the dispersion of this thermal energy may be supplemented by aconvection device 340. This convection device 340 may assist incirculating radiated thermal energy emitting from the surfaces withinthe temperature-controlled unit 310. In some implementations, theconductive surfaces may come in contact with fluids comprisingpredefined thermophysical properties. These thermophysical propertiesmay allow the fluid to store thermal energy to allow for energydissipation over time without requiring a thermal source or powerconnection to supply thermal energy.

Referring now to FIG. 4A-4B, an exemplary temperature control system 400with a thermal path is illustrated. In some embodiments, the thermalpath connector 430 may be actuatable, wherein actuation may break thethermal path. In some implementations, the thermal path connector mayoperate as a actuation mechanism 418 that moves with the rotation axisat the base of the thermal path connector. In some aspects, theactuation mechanism 418 may be activated when the temperature controlsystem 400 loses power.

For example, as a power sensor detects a loss of power, the temperaturecontrol system 400 may utilize the final traces of power stored ascapacitance to activate the actuation mechanism 418. The actuationmechanism 418 may adjust the position of the thermal path connector 430to disrupt the thermal path. In some embodiments, the actuationmechanism 418 may actuate the thermal path connector back to theconnected position, reestablishing continuity of the thermal path whenpower is reconnected to the temperature control system 400.

Referring now to FIG. 4C, an exemplary embodiment of a thermal pathconnector 430 is illustrated. In some embodiments, the pivot mechanism422 may dictate the movement of the thermal path connector 430. Forexample, the pivot mechanism 422 may possess a torsional spring thatcontrols movement in conjunction with a mechanical clasp that releasesthe thermal path connector 430 when power is lost. As another example,the pivot mechanism may be connected to a small motor that controls thedegree of separation of the thermal path connector 430 from thetemperature-controlling device connector.

Referring now to FIG. 5A-5B, an exemplary temperature control systemwith a disruptable thermal path is illustrated. In some embodiments, thetemperature-controlling device 505 may possess a passive heat exchanger515. This may allow for the dissipation of excess thermal energy fromthe temperature control system. In some implementations, thetemperature-controlling device connector 520 may retract from thethermal path connector 530 when the thermal path is disrupted. In someaspects, the conductive surface 535 of the thermal path connector mayremain immobile as the temperature-controlling device connector 520 isremoved from the conductive surface 535 upon retraction.

Referring now to FIG. 6A, a portion of an exemplary temperature controlsystem with an open thermal path is illustrated. In some embodiments,during power loss, a temperature-controlled unit 610 may be actuatedaway from a thermal path connector 630, breaking a thermal path at aconductive surface 635. In some implementations, the separation betweenthe conductive surface 635 may limit heat leak to radiative heatexchange, particularly where the thermal path is insulated in a vacuumjacket. In some aspects, where the thermal path is subjected to gravity,temperature leak may further occur by convection. In someimplementations, power loss may be detected, and as the temperaturecontrol system loses power, an independent low power source may actuatethe thermal path connector 630.

Referring now to FIG. 6B, a portion of an exemplary temperature controlsystem with a closed thermal path is illustrated. In some aspects, oncepower is regained, the thermal path connector 630 may be actuated backtoward the temperature-controlled unit 610, reconnecting at theconductive surface 635. In some embodiments, an actuator may receive aportion of the regained power, which may trigger actuation. Power to thetemperature control system may recharge the independent low power sourceof the actuator. In some embodiments, actuation of the thermal pathconnector 630 may occur through centrifugal force, such as by spinningat least a portion of the temperature control system.

Referring now to FIG. 7, an exemplary temperature control system with anactuator mechanism 718 is illustrated, wherein actuation shifts atemperature-controlled unit 710. In some aspects, an actuator mechanism718 may be installed on the exterior of the temperature control system.Installation of an exterior actuator mechanism 718 may be preferableparticularly where a portion of the temperature control system may becontained within a vacuum jacket 755, which may be a more difficultenvironment to design for. In some implementations, a motor of theactuator mechanism 718 may be installed around the flexible bellows 725of the temperature-controlled unit 710, and an extendable arm may attachto the body of the temperature-controlled unit 710. Extending andretracting the arm may actuate the temperature-controlled unit 710,engaging and disengaging the conductive interface.

In some aspects, actuation of the temperature-controlled unit 710 may beperformed with linear steppers or servo actuators. For example, one ormore linear solenoids, electromagnets, and similar may be used. In someimplementations, separating the conductive interface may not be linear.For example, the gap may occur by rotating one or both the thermal pathconnector and the temperature-controlled unit 710, wherein 2-axisdisplacement plus rotation off-axis may further limit radiative transferby changing the view factor between the two faces.

In some embodiments, a temperature control system may utilize an arrayof temperature-controlled unit 710 that may allow for more precisetemperature control of a load. For example, a plurality oftemperature-controlled unit 710 may be thermally connected to a load atvarious positions. The different positions may require differenttemperatures or may have different temperature sensitivity. In someaspects, the array may be arranged based on the unique cooling orheating needs of a system.

As an illustrative example, a satellite may be built to spin at apredefined speed, wherein the spin may limit exposure of any one portionof the satellite to solar radiation. An array of temperature-controlledunit 710 may be arranged around the satellite, wherein the conductiveinterfaces of each temperature-controlled unit 710 may engage when theportion of the satellite it controls is exposed to a threshold level ofsolar radiation and disengage when the exposure falls below thethreshold level.

Referring now to FIG. 8A, an exemplary temperature control system 800with a closed thermal path is illustrated, wherein a rigid conductivebar thermal path connector 830 provides a thermal path between thepassive heat exchanger 815 and a temperature-controlled unit 810. Insome aspects, a thermal path connector 830 may provide two conductivesurfaces 835, 836 along a thermal path. In some embodiments, the thermalpath connector 830 may actuate around a pivot mechanism 822, which mayallow for control of the connections at the conductive surfaces 835,836. For example, a rigid conductive bar may serve this purpose offacilitating this connection as a thermal path connector 830.

The temperature control system 800 may comprise a power sensor 860,which may monitor power levels. The power sensor 860 may detect when apower level falls below a predefined threshold level, wherein detectionmay cause activation of the pivot mechanism 822. In someimplementations, the power sensor 860 may be configured to detectunexpected loss of power, wherein intentional disconnection of thetemperature control system 800 may not trigger activation of the pivotmechanism 822.

Referring now to FIG. 8B, an exemplary temperature control system 800with an open thermal path is illustrated, wherein a thermal pathconnector 830 provides a thermal path between a temperature-controlledunit 810 and a passive heat exchanger 815. In some embodiments, a pivotmechanism 822 may actuate the thermal path connector 830. In someaspects, pivoting a thermal path connector 830 may break the thermalpath, and disengage conductive surfaces 835, 836 in a non-linearorientation.

Referring now to FIG. 9A, an exemplary temperature control system 900with a closed thermal path is illustrated. In some embodiments, thethermal path between a temperature-controlling device 905 and atemperature-controlled unit 910 may comprise a thermal path connector930. In some implementations, the temperature control system 900 maycomprise multiple conductive surfaces 935, 936 which may further reduceheat leak during power loss. In some aspects, the conductive interfaces935, 936 may be located between the temperature-controlling device 905and the thermal path connector 930 and between the thermal pathconnector 930 and the temperature-controlled unit 910. In someimplementations, an actuation mechanism 918 may shift the thermal pathconnector 930, wherein the actuator mechanism 918 may be activated whenpower loss is detected.

Referring now to FIG. 9B, an exemplary temperature control system 900with an open thermal path is illustrated. In some embodiments, powerloss may be detected, which may activate an actuator mechanism 918. Theactuator mechanism 918 may pull the thermal path connector 930, breakingthe thermal path at the conductive interfaces 935, 936 and a thermalpath connector 930 conductive interface that is located between thesegments. Though shown in two segments, different types of segmentationmay be beneficial. As the number of conductive interfaces increase, thepotential inefficiencies associated with contact resistance may alsoincrease, which requires a balance between the two opposing factors.

Referring now to FIG. 10A, a portion of an exemplary temperature controlsystem with an open thermal path is illustrated, wherein control of thethermal path occurs electromagnetically. In some embodiments, a normallyopen configuration for the thermal path may limit the need for power tobreak the thermal path during power loss. In some aspects, atemperature-controlling device 1005 may comprise a magnet 1053, and atemperature-controlled unit may comprise a magnet 1052. Without power,the thermal path connector 1030 may not be attracted to the magnet 1053,which may allow for a normally open configuration with a disengagedconductive surface 1035.

Referring now to FIG. 10B, a portion of an exemplary temperature controlsystem with a closed thermal path is illustrated, wherein control of thethermal path occurs electromagnetically. In some aspects, when thetemperature control system receives power, the magnet 1052 on thethermal path connector 1030 may be activated and attract the magnet 1053on the temperature-controlling device 1005. In some embodiments, theattraction may connect the conductive surface 1035 and close the thermalpath. In some implementations, a thermal path connector 1030 is shown asan illustrative example, as a thermal strap, which may be flexible toallow for movement during engagement and disengagement of the magnet1052. Though not shown, a thermal path may be provided by otherconductive mechanisms, such as a rigid bar, plates, semiconductors.Where the conductive mechanism may not be flexible, the temperaturecontrol system may comprise a mechanism that allows for at least limitedmovement of the conductive mechanism.

Referring now to FIG. 11A, a portion of an exemplary temperature controlsystem with an open thermal path is illustrated, wherein the thermalpath comprises a normally open configuration. In some aspects, anactuator mechanism 1118 may actuate a thermal path connector 1130,wherein actuation may control a conductive surface 1135. In someembodiments, the thermal path connector 1130 may be contained in avacuum jacket 1155, wherein the actuator mechanism 1118 may becompletely contained within the vacuum jacket 1155 or may operateoutside the vacuum jacket 1155.

As shown, the actuator mechanism 1118 may be located outside the vacuumjacket 1155. In some embodiments, flexible bellows 1125 may attach thethermal path connector 1130 to the actuator mechanism 1118. Though shownwithin the flexible bellows 1125, a vacuum jacket 1155 may be moreinclusive and may surround one or more of the thermal path connector1130, the actuator mechanism 1118, or temperature-controlling device1105. In some implementations, the flexible bellows 1125 may act as aspring, wherein the resting position allows for a normally openconfiguration.

Referring now to FIG. 11B, a portion of an exemplary temperature controlsystem with a closed thermal path is illustrated, wherein the thermalpath comprises a normally open configuration. In some embodiments, anactuator mechanism 1118 may actuate the thermal path connector 1130 toconnect the conductive surface 1135 and close the thermal path. In someaspects, actuating the thermal path connector 1130 may compress theflexible bellows 1125, wherein actuation may require power input. Insome embodiments, the power source may be the same or different than forthe temperature-controlling device 1105 or other components of thetemperature control system. In some implementations, the compression ofthe flexible bellows 1125 may store sufficient energy so during powerloss, the bellows 1125 may cause separation of the conductive surface1135.

Referring now to FIG. 12A-12B, a portion of an exemplary temperaturecontrol system 1200 with a container 1250 within atemperature-controlled unit 1210 is illustrated. In some embodiments,the container 1250 may contain phase change material that may retainthermal energy. In some implementations, the phase change material maycontinue to maintain a predefined temperature without power for anextended period of time.

For example, the phase change material may be cooled to a predefinedtemperature, such as −70° C., 230° C., or 0° C., as non-limitingexamples. When the power is disconnected, the phase change material maymaintain a predefined temperature within the temperature-controlled unit1210 for a predetermined amount of time, such as 2 hours, 4 days, or 36hours, as non-limiting examples. In some aspects, the phase changematerial may be located within smaller containers, sleeves, or sacswithin the container 1250 of the temperature-controlled unit 1210.

In some implementations, the phase change material may be removeable.For example, a composite material may be more conducive to maintaining alower temperature within the temperature-controlled unit 1210. A viscousliquid may be substituted for the composite material as a different loadis introduced into the temperature-controlled unit 1210 and thetemperature requirements change. In some embodiments, the walls of thecontainer 1250 may be hollow. In some implementations, hollow wallswithin the container 1250 may allow for the presence of phase changematerial. In some aspects, the walls of the container 1250 may enclosethe phase change material to prevent interaction with the load insertedwithin the temperature-controlled unit 1210.

Referring now to FIG. 13A-13B, an exemplary embodiment of atemperature-controlled unit 1310 with rigid bellows 1365, a vacuumjacket 1355, convective device is illustrated. In some embodiments, thetemperature-controlled unit may utilize a vacuum jacket 1355 to insulatethe temperature within the temperature-controlled unit 1310. In someimplementations, rigid bellows 1365 may be utilized to reduce heat lossas the ambient temperature comes to equilibrium with the predefinedtemperature within the temperature-controlled unit 1310. Rigid bellowsmay apply to any surface that encounters the ambient temperature outsideof the temperature-controlled unit 1310. In some aspects, equaldistribution of the predefined temperature throughout thetemperature-controlled unit may be assisted by a convective device. Forexample, a convective fan may be positioned in the center of the base ofthe temperature-controlled unit 1310 to ensure the top of thetemperature-controlled unit 1310 has adequate cold air due to theincreased density of cold air.

Referring now to FIG. 13C, an exemplary temperature-controlled unit 1310comprising a container 1315 is illustrated, wherein the container 1315comprises a lid 1367 in an open position. In some aspects, a container1315 may comprise an opening 1317 that may receive a load into a cavity1319 of the container 1315. In some embodiments, a lid 1367 may comprisea movable panel that may control access to the opening 1317. In someimplementations, one or both the opening 1317 and the lid 1367 maycomprise rigid bellows 1365 along the perimeter, which may limittemperature leak when the lid is in a closed position.

Referring now to FIGS. 13D and 13E, exemplary rigid bellows 1365 areillustrated. In some embodiments, one or more of atemperature-controlled unit, temperature-controlling device, or thermalpath connector may comprise rigid bellows 1365, which may limittemperature leak. In some aspects, the thinner the material and the morepleating, the more effective the rigid bellows 1365 may be at limitingtemperature. In some embodiments, actuation of a thermal path connectormay shift rigid bellows 1365 to the open thermal interfaces between thethermal path connector and one or both the temperature-controlled unitor temperature-controlling device. The rigid bellows 1365 may furtherlimit temperature leak by increasing the effectiveness of disconnectinga thermal path between the temperature-controlled unit andtemperature-controlling device.

Referring now to FIG. 14A-14B, a portion of an exemplary temperaturecontrol system 1400 with a temperature-controlled unit 1410 isillustrated. In some embodiments, the temperature-controlled unit maycomprise an insulated vacuum jacket 1455. In some aspects, the vacuumjacket 1455 may contain a medium to assist in providing additionalinsulation. For example, glass microspheres may fill the cavity of thevacuum jacket 1455 due to insulative properties of glass. This mayimpede the transference of heat dissipation through the vacuum jacket1455.

In some implementations, the temperature-controlled unit may utilizerigid bellows 1465 to reduce heat loss from the temperature-controlledunit 1410 interacting with the ambient temperature. In some aspects, thetemperature-controlled unit may comprise a plurality of conductivesurfaces 1435 to bring phase change material to the predefinedtemperature. In some embodiments, the temperature-controlled unit maycomprise a continuous conductive surface 1435 that extends to theplacement of the phase change material to facilitate equal thermalenergy distribution. In some implementations, the conductive surface1435 may extend to a vertical orientation to increase the efficiency ofdistributing thermal energy to the phase change material.

Referring now to FIG. 15A-15B, an exemplary embodiment of atemperature-controlled unit 1500 with a conductive interface 1535 isillustrated. In some embodiments, the conductive interface 1535 mayextend from the thermal path connector to the hinges of the lid. Thismay allow thermal energy transference to phase change material storedwithin the lid of the temperature-controlled unit 1510.

Referring now to FIG. 16A-16B, an exemplary embodiment of a visualindicator 1670 is illustrated. In some embodiments, a disconnection frompower may release a signal displayed on a visual indicator 1670. In someimplementations, the visual indicator 1670 may provide information aboutwhen the power was disconnected. For example, the visual indicator 1670may show a temperature, time of power loss, and amount of time for thetemperature-controlled unit to begin loss of temperature control. Asnon-limiting examples, when power is supplied, the visual indicator 1670may indicate the current temperature of the temperature-controlled unit,the target temperature of the temperature-controlled unit, status of thetemperature-controlling device, power status, or maintenance indicators.

In some aspects, the visual indicator 1670 may provide informationdetailing the estimated time until the temperature threshold within thetemperature-controlled unit is compromised. In some embodiments, thisvisual indicator 1670 may utilize low quantities of energy to inscribean energy independent message on the visual indicator 1670. For example,the visual indicator 1670 may utilize electronic ink that retains a formmemory after its initial creation via electrical impulse. In someimplementations, the visual indicator 1670 may possess lights toindicate power connection and power loss.

Referring now to FIG. 17A-17B, an exemplary embodiment of a rotatingexternal temperature control system is illustrated. In some embodiments,a temperature control system 1700 may utilize an array oftemperature-controlled unit 1710 that may allow for more precisetemperature control of a load. For example, a plurality oftemperature-controlled unit 1710 may be thermally connected to a load atvarious positions. The different positions may require differenttemperatures or may have different temperature sensitivity. In someaspects, the array may be arranged based on the unique cooling orheating needs of a system.

As an illustrative example, a satellite may be built to spin at apredefined speed, wherein the spin may limit exposure of any one portionof the satellite to solar radiation. An array of temperature-controlledunit 1710 may be arranged around the satellite, wherein the conductiveinterfaces of each temperature-controlled unit 1710 may engage when theportion of the satellite it controls is exposed to a threshold level ofsolar radiation and disengage when the exposure falls below thethreshold level.

Referring now to FIG. 18, an exemplary embodiment of a temperaturecontrol system 1800 comprising a plurality of zones 1810 within atemperature-controlled unit is illustrated. In some embodiments, atemperature control system 1800 may utilize a plurality of zones 1810that may allow for varied temperature control of a plurality of loads.For example, one zone 1810 may maintain a load at a temperature of −70°C. while an adjacent zone 1811 may maintain a separate load at atemperature of 170° C. The temperature-controlled unit zones 1810,1811may require different temperatures or may have different temperaturesensitivity. In some aspects, the array may be arranged based on theunique cooling or heating needs of a system. In some embodiments, aninsulation medium may exist between the temperature-controlled unitzones 1810,1811 to reduce heat transference.

In some implementations, separate temperature-controlling devices mayindependently control each temperature-controlled unit zone 1810, 1811.In some aspects, a temperature-controlling device may control multipletemperature-controlled unit zones 1810, 1811. A temperature-controllingdevice may cycle through temperature control states, such as heating,cooling, and off states, depending on the predefined target temperaturesof the temperature-controlled unit and temperature-controlled unit zones1810, 1811.

Referring now to FIG. 19, an exemplary cycle of connecting and breakinga thermal path within a thermal system is illustrated. At 1905, powerloss may be detected, such as based on predefined thresholds. At 1910,actuators may break a thermal path. At 1915, heat leak may be limited toradiative transfer. In some aspects, power loss may be detected by asensor, which may trigger actuation at 1910. In some embodiments, powerloss may occur without a sensor, wherein loss of powerelectromechanically causes an actuation. At 1920, power may beresupplied. At 1925, actuators may reorient and reconnect the thermalpath. At 1930, cooling operations may resume.

Referring now to FIG. 20, exemplary method steps for breaking a thermalpath in response to a detected loss in power are illustrated, whereinthe thermal path comprises a normally closed configuration. At 2005,power may be monitored. At 2010, power loss may be sensed. In someembodiments, the monitoring and sensing may occur directly, such asthrough a sensor. In some aspects, portions of the system may beprogrammed to operate when power levels fall below a threshold. At 2015,at least one conductive interface may be disengaged, whereindisengagement may break a thermal path. At 2020, power restoration maybe detected. At 2025, the conductive interface may be re-engaged,wherein re-engagement may close the thermal path.

Referring now to FIG. 21, exemplary method steps for engaging a thermalpath upon receipt of power are illustrated, wherein the thermal pathcomprises a normally open configuration. At 2105, power may be received.In some aspects, the power received may be for the cooling system ingeneral. In some implementations, the power received may be specificallyto control the thermal path. At 2110 at least one conductive interfacemay be engaged, wherein engagement may close a thermal path. In someaspects, at 2115, power loss may be detected. At 2120, the conductiveinterface may be disengaged, wherein disengagement may break the thermalpath. In some embodiments, the disengagement may occur passively due tothe loss of power.

CONCLUSION

A number of embodiments of the present disclosure have been described.While this specification contains many specific implementation details,these should not be construed as limitations on the scope of anydisclosures or of what may be claimed, but rather as descriptions offeatures specific to particular embodiments of the present disclosure.

Certain features that are described in this specification in the contextof separate embodiments can also be implemented in combination or in asingle embodiment. Conversely, various features that are described inthe context of a single embodiment can also be implemented incombination in multiple embodiments separately or in any suitablesub-combination. Moreover, although features may be described above asacting in certain combinations and even initially claimed as such, oneor more features from a claimed combination can in some cases be excisedfrom the combination, and the claimed combination may be directed to asub-combination or variation of a sub-combination.

Similarly, while operations are depicted in the drawings in a particularorder, this should not be understood as requiring that such operationsbe performed in the particular order shown or in sequential order, orthat all illustrated operations be performed, to achieve desirableresults. In certain circumstances, multitasking and parallel processingmay be advantageous.

Moreover, the separation of various system components in the embodimentsdescribed above should not be understood as requiring such separation inall embodiments, and it should be understood that the described programcomponents and systems can generally be integrated together in a singlesoftware product or packaged into multiple software products.

Thus, particular embodiments of the subject matter have been described.Other embodiments are within the scope of the following claims. In somecases, the actions recited in the claims can be performed in a differentorder and still achieve desirable results. In addition, the processesdepicted in the accompanying figures do not necessarily require theparticular order show, or sequential order, to achieve desirableresults. In certain implementations, multitasking and parallelprocessing may be advantageous. Nevertheless, it will be understood thatvarious modifications may be made without departing from the spirit andscope of the claimed disclosure.

What is claimed is:
 1. A temperature control system comprising: atemperature-controlled unit; a temperature-controlling device configuredto control a temperature of the temperature-controlled unit, wherein thetemperature controlling device is connectable to a power source; athermal path connector comprising: an actuatable connector comprising afirst end comprising a first thermal interface connectable to thetemperature-controlled unit; a second end comprising a second thermalinterface connectable to the temperature-controlling device; and anactuation mechanism configured to actuate the actuatable connector basedon predefined parameters, wherein actuation of the actuatable connectorcontrols connection of one or both the first thermal interface to thetemperature-controlled unit and the second thermal interface and thetemperature-controlling device, and wherein when connected, a thermalpath between the temperature-controlled unit and thetemperature-controlling device is continuous, and wherein when one orboth the first thermal interface and the second thermal interface isdisconnected, the thermal path is broken.
 2. The system of claim 1,wherein actuation of the thermal path connector occurs with power loss.3. The system of claim 2, wherein the temperature control systemcomprises a power detector configured to detect power loss, wherein thepower detector prompts actuation of the thermal path connector.
 4. Thesystem of claim 1, wherein the temperature-controlled unit comprises aplurality of zones, wherein temperature of each zone is independentlycontrollable.
 5. The system of claim 1, wherein thetemperature-controlling device comprises a thermodynamic engine.
 6. Thesystem of claim 1, wherein the temperature-controlled unit comprises: acontaining portion comprising: a cavity comprising at least a firstcontaining wall to contain a load, wherein the temperature-controllingdevice directly or indirectly controls a load temperature when the loadis located within the cavity, an opening configured to receive the loadinto the cavity; and a lid comprising a movable cover configured tocontrol access to the opening, wherein a closed position of the lidlimits passive temperature change within the cavity.
 7. The system ofclaim 6, wherein one or both the lid and the opening further comprisesrigid bellows configured to limit passive temperature change within thecavity.
 8. The system of claim 6, wherein the temperature-controlledunit further comprises a second containing wall, wherein the secondcontaining wall surrounds the first containing wall.
 9. The system ofclaim 8, wherein a space between the first containing wall and thesecond containing wall comprises a vacuum jacket.
 10. The system ofclaim 1, wherein the temperature control system is configured to operatein one or both microgravity or zero gravity conditions.
 11. The systemof claim 1, wherein the actuatable connector comprises a thermal strap.12. A thermal path connector comprising: an actuatable connectorcomprising a first end comprising a first thermal interface connectableto a temperature-controlled unit; a second end comprising a secondthermal interface connectable to a temperature-controlling device; andan actuation mechanism configured to actuate the actuatable connectorbased on predefined parameters, wherein actuation of the actuatableconnector controls connection of one or both the first thermal interfaceto the temperature-controlled unit and the second thermal interface andthe temperature-controlling device, and wherein when connected a thermalpath between the temperature-controlled unit and thetemperature-controlling device is continuous, and wherein when one orboth the first thermal interface and the second thermal interface isdisconnected, the thermal path is broken.
 13. The thermal path connectorof claim 12, wherein the thermal path connector comprises a pivotmechanism connected to the actuatable connector, wherein actuation ofthe actuatable connector occurs by pivoting the thermal path connectorand wherein pivoting disconnects one or both the first thermal interfaceand the second thermal interface.
 14. The thermal path connector ofclaim 12, wherein breaking the thermal path limits passive temperaturechange of the temperature-controlled unit.
 15. The thermal pathconnector of claim 12, wherein actuation of the actuatable connectoroccurs with power loss.
 16. The thermal path connector of claim 12,wherein a resting state of the thermal path connector disconnects one orboth the first thermal interface to the temperature-controlled unit andthe second thermal interface and the temperature-controlling device. 17.The thermal path connector of claim 12, wherein the actuatable connectorcomprises a thermal strap.
 18. A temperature control system comprising:a temperature-controlled unit; a plurality of temperature-controllingdevices connectable to a power source, wherein each of the plurality oftemperature-controlling devices is configured to control temperature ofthe temperature-controlled unit when connected to the power source; anda first thermal path connector comprising: a first actuatable connectorcomprising: a first end comprising a first thermal interface connectableto the temperature-controlled unit, a second end comprising a secondthermal interface connectable to at least a first portion of theplurality of temperature-controlling devices, and a first actuationmechanism configured to actuate the first actuatable connector based onpredefined parameters, wherein actuation of the first actuatableconnector controls connection of one or both the first thermal interfaceand the second thermal interface, and wherein when both the firstthermal interface and the second thermal interface are connected athermal path between the temperature-controlled unit and at least thefirst portion of temperature-controlling devices is continuous, andwherein when one or both the first thermal interface and the secondthermal interface is disconnected, the thermal path is broken.
 19. Thesystem of claim 18, further comprising a second thermal path connectorcomprising: a second actuatable connector comprising: a third endcomprising a first thermal interface connectable to thetemperature-controlled unit, a fourth end comprising a second thermalinterface connectable to at least a second portion of the plurality oftemperature-controlling devices, and a second actuation mechanismconfigured to actuate the second actuatable connector based onpredefined parameters, wherein actuation of the actuatable connectorcontrols connection of one or both the third thermal interface and thefourth thermal interface, and wherein when both the second thermalinterface and the fourth thermal interface are connected a thermal pathbetween the temperature-controlled unit and at least the second portionof temperature-controlling devices is continuous, and wherein when oneor both the third thermal interface and the fourth thermal interface isdisconnected, the thermal path is broken.
 20. The system of claim 18,wherein breaking the thermal path limits passive temperature change ofthe temperature-controlled unit.